| Customization: | Available |
|---|---|
| After-sales Service: | Online Technical Support |
| Warranty: | One Year |
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| PL-5050P LCD screen model | |||||
| Technical specification | Nozzle models available | Nozzle treatment area | Model | ||
| Interface display | 4.3-inch LCD screen without touch | R17 Rotate nozzle 16 |
16mm | PL-JX-022-1 | |
| Rated supply voltage | AC220V ±10% | R03 Rotary nozzle 20 |
20mm | PL-JX-004-1 | |
| Plasma output power | 750-1500W | R04 Rotary nozzle 30 |
30mm | PL-JX-006-1 | |
| Input current | 4.0-8.0A | R21 Rotary nozzle 40 |
40mm | PL-JX-008-1 | |
| Supply frequency | 17.3-30kHz | R05 Rotary nozzle 50 |
50mm | PL-JX-010-1 | |
| Air source requirement | External air source (gas consumption 60L/min | R23 Rotate nozzle 70 |
75mm | PL-JX-014-1 | |
| Air source input pressure | ≥0.6Mpa | R19 Rotary nozzle 85 |
85mm | PL-JX-016-1 | |
| Air pressure operating range | 0.1-0.3Mpa | R20 Rotary nozzle 100 |
110mm | PL-JX-018-1 | |
| Mode | Signal Mode/ Encoder Mode | ||||
| Relative humidity | <93% | |
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| Storage temperature | -25ºC-+55ºC | ||||
| Cleaning height | 5-15mm | ||||
| Treatment width | ≤110mm | ||||
| Bracket | Dovetail support | ||||
| Chassis dimensions (including components) | 590(L)*350(W)*365(H)mm | ||||
| Net weight | 28kg | ||||
| Dimensions of the outer packing box | 660(L)*395(W)*530(H)mm | ||||
| Gross weight | 37kg | ||||
| Detection function | Air pressure detection, overtemperature detection, motor speed detection, driver fault detection | ||||
| Fault alarm | Undercurrent, input overcurrent, output overcurrent, abnormal air pressure, driver fault ALARM output, motor speed abnormal ALARM output | ||||
Plasma cleaning of leadframes removes organic films, oxides, and antitarnish layers, delivering ultra-clean, high-energy surfaces that dramatically improve wire-bond and solder-joint reliability. Atmospheric-pressure plasma (APP) modules can be integrated inline on SMT and flip-chip lines, providing millisecond-scale treatments without vacuum chambers. Reactive species (O, OH, H) and UV photons synergistically etch and functionalize copper and silver surfaces, raising surface energy above 50 mN/m and enabling void-free solder wetting . Case studies show voiding rates drop below 1% and joint shear strength increases by up to 30% after plasma treatment of leadframes.
Leadframes-metallic support structures for semiconductor dies-are prone to surface contamination from stamping oils, antitarnish coatings (e.g., benzotriazole), and handling residues, all of which impair solder wetting and wire-bond adhesion. Traditional cleaning uses wet chemicals or vacuum plasma systems, which generate wastewater or require costly vacuum equipment and long cycle times. With the advent of atmospheric-pressure plasma, manufacturers can now achieve equivalent or superior cleaning in line, eliminating solvents and reducing footprint.
Atmospheric-pressure plasma (APP) systems operate at ambient pressure and use high-voltage discharges in argon, nitrogen, or air to generate reactive radicals and UV light for surface activation. Low-pressure (vacuum) plasma provides highly uniform treatment but demands vacuum pumps and chambers, making it less suitable for high-throughput lines.
Compact plasma nozzles or showerheads can be mounted directly above conveyorized leadframe tracks, treating each frame in milliseconds just before solder paste deposition or wire bonding. This placement minimizes re-contamination and aligns with existing SMT/flip-chip workflows.
Micro-Etching and Oxide Removal
Ionic and radical bombardment selectively strips oxides and tarnish from copper and silver leadframes, uncovering fresh metal.
Chemical Functionalization
Polar functional groups (-OH, -NH2) graft onto the metal surface, boosting surface energy from ~30 mN/m to above 50 mN/m, improving solder alloy spread.
Residue Volatilization
Organic contaminants and stamping oils are fragmented and vaporized, preventing void entrapment during solder reflow.
Enhanced Solder Wetting and Joint Strength
Solder wetting angles decrease by 15-20°, while shear strength of solder bumps improves by up to 30%.
Reduced Voiding and Higher Yields
Inline plasma cleaning cuts solder-void rates from ~3% to below 1%, lifting first-pass yields by 5-10%.
Green Manufacturing
Eliminates chemical solvents and rinse stages, slashing wastewater generation and chemical handling costs.
Process Flexibility
Adjustable plasma power, gas mix (Ar/H2 or N2), and nozzle geometry allow tailoring to different leadframe alloys and line speeds.
Gas Chemistry: Ar/H2 mixtures excel in oxide removal, while nitrogen or air systems suffice for organic contamination.
Power & Frequency: RF (13.56 MHz) systems at 100-300 W yield uniform plasma without overheating delicate frames.
Nozzle-to-Surface Distance: Maintain 5-15 mm gap to balance radical flux and coverage uniformity.
Treatment Timing: 200-500 ms per frame is typically sufficient; optimize based on line speed and contamination level.
Plasma cleaning and activation of leadframes unlock higher solder joint reliability, lower void rates, and greener processes. By integrating compact atmospheric-pressure plasma modules into existing packaging lines, manufacturers can achieve fast, solvent-free treatments that boost yields and reduce costs-making plasma technology a cornerstone of next-generation semiconductor assembly.
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