| Customization: | Available |
|---|---|
| After-sales Service: | Online Technical Support |
| Warranty: | One Year |
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| VLOL-12-A On-line Vacuum Plasma Cleaning Machine | ||||
| Technical specification | ||||
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Host | Dimension | 1350(L)×1600(W)×2300 (H)mm, customizable | |
| Cavity dimension | 330(W)×110(H)×370(D)mm(Width x height x depth)customizable | |||
| Fit product dimension | 50~100(W)×150~280(L)mm, customizable | |||
| Power | Plasma power | 13.56MHz 300W~100W | ||
| Power | 300W | |||
| Control system | Loading and unloading method | Automatic feed in and out | ||
| Control mode | PLC(Siemens)+HIM | |||
| Vacuum system | Cavity material | Aluminium alloy |
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| Cavity leakage rate | >5s/pa | |||
| Layer | 1 layer | |||
| Vacuum breaking time | ≤10S | |||
| Pumpdown time | ≤10S | Optional vacuum pump | ||
| Vacuum pump | 60m³/h | |||
| Gas | Process gas flow range | 0~300SCCM | ||
| Process gas path (customizable) | Standard configuration: Argon and oxygen two-way process gas(2 MFC) | |||
| Factory requirements | Device power supply | 380V 50HZ | ||
| Device air source | >0.4MPA | |||
| Device power | 4KW | |||
| Work environment | from o°C to 50°C | |||
The VLOL-12-A Online Vacuum Plasma Cleaning Machine from KeyLink is a turnkey, inline vacuum plasma system specifically tailored for cleaning and activating leadframes in semiconductor packaging. It operates at 220 V with a 13.56 MHz, 300 W plasma generator and features a customizable treatment cavity (330 × 110 × 370 mm) to handle leadframes up to 100 × 280 mm, achieving millisecond-scale cleaning cycles under 10 s pump-down and vacuum-break times. By removing stamping oils, antitarnish coatings, and micro-oxides, it raises surface energy above 50 mN/m, dramatically improving solder wetting and wire-bond adhesion, while eliminating chemical solvents and wastewater.
The VLOL-12-A integrates automatic loading and unloading via PLC control (Siemens + HMI), feeding leadframes into an aluminum alloy vacuum chamber for dry, plasma-based cleaning. Its cavity leakage rate exceeds 5 s/Pa, ensuring rapid pump-down (≤ 10 s) and venting, thus fitting seamlessly into high-throughput SMT or die-attach lines. The system accepts process gases through dual MFCs (argon + oxygen standard) at 0-300 SCCM, offering precise control over plasma chemistry to target both organic and inorganic contaminants.
Hydrogen and argon radicals generated at low pressure effectively reduce copper and silver oxides, exposing fresh metal surfaces essential for solder bonding. Energetic ions also dislodge benzotriazole antitarnish films, preventing void formation during reflow.
Reactive oxygen species (O, OH) and UV photons cleave and volatilize stamping oils and flux residues at the molecular level, avoiding residue entrapment in solder joints.
Plasma grafts polar -OH and -NH2 groups onto leadframe surfaces, boosting surface energy from ~30 mN/m to > 50 mN/m, which enhances wetting and underfill adhesion.
Superior Solder Wetting & Yield: Inline vacuum plasma reduces solder-void rates from ~3 % to < 1 %, increasing first-pass yields by 5-10 %.
Enhanced Joint Strength: Treated leadframes exhibit 25-30 % higher wire-bond shear strength and solder bump pull-off forces, mitigating NSOP failures.
Green & Cost-Effective: Eliminates chemical solvents and rinse baths, cutting wastewater treatment costs and meeting environmental regulations.
Seamless Line Integration: Millisecond treatment cycles (< 800 ms) with pump-down/vent times ≤ 10 s allow incorporation into conveyor-based packaging lines without bottlenecks.
Gas Selection: Argon/hydrogen mixtures optimize oxide reduction; pure argon or argon/oxygen targets organic removal plasmatreat.
Power & Frequency: The 13.56 MHz RF source at 300 W balances fast cleaning with minimal substrate heating; optional adjustment down to 100 W for delicate frames.
Chamber Design: The 330 × 110 × 370 mm cavity accommodates various leadframe sizes (50-100 × 150-280 mm) with uniform plasma distribution via overhead electrodes.
Control Strategy: PLC + HMI integration enables recipe management and real-time monitoring of pressure, gas flow, and power for repeatable results.
A tier-1 OSAT provider installed the VLOL-12-A upstream of its die-attach line. Post-installation metrics showed voiding rates plummet from 2.8 % to 0.6 %, first-pass yields rose by 8 %, and solder bump shear strength increased by 27 % compared to legacy wet-chemical cleaning.
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