| Customization: | Available |
|---|---|
| After-sales Service: | Online Technical Support |
| Warranty: | One Year |
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| PL-5050P LCD screen model | |||||
| Technical specification | Nozzle models available | Nozzle treatment area | Model | ||
| Interface display | 4.3-inch LCD screen without touch | R17 Rotate nozzle 16 |
16mm | PL-JX-022-1 | |
| Rated supply voltage | AC220V ±10% | R03 Rotary nozzle 20 |
20mm | PL-JX-004-1 | |
| Plasma output power | 750-1500W | R04 Rotary nozzle 30 |
30mm | PL-JX-006-1 | |
| Input current | 4.0-8.0A | R21 Rotary nozzle 40 |
40mm | PL-JX-008-1 | |
| Supply frequency | 17.3-30kHz | R05 Rotary nozzle 50 |
50mm | PL-JX-010-1 | |
| Air source requirement | External air source (gas consumption 60L/min | R23 Rotate nozzle 70 |
75mm | PL-JX-014-1 | |
| Air source input pressure | ≥0.6Mpa | R19 Rotary nozzle 85 |
85mm | PL-JX-016-1 | |
| Air pressure operating range | 0.1-0.3Mpa | R20 Rotary nozzle 100 |
110mm | PL-JX-018-1 | |
| Mode | Signal Mode/ Encoder Mode | ||||
| Relative humidity | <93% | |
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| Storage temperature | -25ºC-+55ºC | ||||
| Cleaning height | 5-15mm | ||||
| Treatment width | ≤110mm | ||||
| Bracket | Dovetail support | ||||
| Chassis dimensions (including components) | 590(L)*350(W)*365(H)mm | ||||
| Net weight | 28kg | ||||
| Dimensions of the outer packing box | 660(L)*395(W)*530(H)mm | ||||
| Gross weight | 37kg | ||||
| Detection function | Air pressure detection, overtemperature detection, motor speed detection, driver fault detection | ||||
| Fault alarm | Undercurrent, input overcurrent, output overcurrent, abnormal air pressure, driver fault ALARM output, motor speed abnormal ALARM output | ||||
Systems generate a nonequilibrium glow discharge at ambient pressure by applying high voltage to a working gas (Ar, N2, H2, or air) between electrodes. Reactive species (atomic O, OH, H) and UV photons synergistically break molecular bonds of contaminants and oxidize organic residues.
Compact plasma nozzles or showerheads can be mounted inline on conveyorized SMT or flip-chip lines. Treatment occurs in milliseconds per pad, immediately prior to solder paste deposition or underfill dispensing, minimizing airborne re-contamination.
Micro-Etching ("Micro-Blast")
Ionic and radical bombardment removes ultrathin oxide layers and increases surface roughness on a nanometer scale, improving mechanical interlocking of molten solder.
Chemical Functionalization
Polar groups (-OH, -NH2) graft onto metal and polymer surfaces, raising surface energy from ~30 mN/m to >50 mN/m, which enhances solder alloy wetting and spreading.
Residual Removal
Volatilization of flux residues and organic films prevents gas entrapment under solder joints, mitigating void formation.
Improved Solder Wetting & Joint Reliability
Joint shear and pull-off strengths increase by up to 30%, while voiding rates drop below 1% in high-density interconnects.
Higher First-Pass Yield
Inline plasma cleaning modules can raise first-pass yields by 5-10% by reducing rework and scrap.
Green & Cost-Effective
Eliminates solvent use and wastewater, reduces chemical inventory, and lowers total cost of ownership compared to vacuum plasma or wet-chemical systems.
Process Flexibility
Compatible with diverse materials- copper, aluminum, polymeric underfills- and easily programmed for varying line speeds and patterns.
Gas Selection: Argon or argon/hydrogen mixtures excel at rapid oxide removal; air or nitrogen systems offer a more economical alternative for organic contamination.
Power & Frequency: Higher power densities shorten treatment time but risk substrate heating; radio-frequency (13.56 MHz) systems provide uniform plasma at moderate power.
Module Placement: Optimal distance between plasma nozzle and substrate is 5-15 mm to balance reactive species density and coverage uniformity.
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